More Products From This Vendor
GE Fanuc IC693ACC310 Series 90-30 Filler Module
Description
The GE Fanuc IC693ACC310, also cataloged as the IC693ACC310 Filler Module, operates as a dedicated hardware component for empty slot protection and backplane bus connector shielding within GE Series 90-30 PLC baseplates.
Hardware Specifications
| Parameter | Specification |
|---|---|
| Model | IC693ACC310 |
| Brand | GE Fanuc |
| Product Series | Series 90-30 PLC |
| Module Type | Blank / Filler Module |
| Origin | USA |
| Weight | 0.12 kg |
| Dimensions | 3.5 x 13 x 13.5 cm |
| Power Consumption | 0 mA at 5 VDC (Passive Component) |
| Operating Temp | 0 to 60 deg C |
| Storage Temp | -40 to 85 deg C |
| Discontinued Date | Dec 31, 2018 |
| HS Code | 8537101190 |
Backplane Bus Physical Shielding and Thermal Airflow Distribution
The IC693ACC310 filler module maintains structural and environmental integrity across empty slots in 5-slot and 10-slot Series 90-30 baseplates (IC693CHS391, IC693CHS392, IC693CHS397, IC693CHS398). The unit contains no active electronic circuitry, internal printed circuit board (PCB), or backplane pin headers, preventing electrical load on the system 5 VDC or 24 VDC power supply rails.
The structural frame directs convection thermal airflow across adjacent active I/O cards, preventing heat buildup in unpopulated rack sections. The plastic housing covers exposed backplane bus connectors, preventing airborne particulate deposition, metallic debris contamination, and direct electrostatic discharge (ESD) contact on passive backplane signal lines.
Frequently Asked Questions
Q: Does the IC693ACC310 consume current from the Series 90-30 backplane power supply?
A: No. The module contains no electrical contact pins or internal circuitry and draws 0 mA from both the 5 VDC logic bus and the 24 VDC relay power bus.
Q: Can the IC693ACC310 be installed or removed while the baseplate is powered?
A: Yes. Because the hardware engages no backplane electrical connectors, insertion or removal of the filler panel does not disturb active backplane bus communication velocity or trigger system bus fault interrupts.
Field Installation Guidelines
- Inspect the baseplate slot location for debris or mechanical obstruction before mounting.
- Align the top rear hook of the IC693ACC310 module housing with the notch located at the top of the Series 90-30 baseplate slot.
- Pivot the module downward against the baseplate chassis until the bottom plastic retaining clip snaps into the lower mounting rail.
- Verify physical alignment with adjacent operational I/O modules to ensure complete enclosure coverage without gaps.
- Maintain standard panel grounding procedures for the baseplate assembly to limit ambient electromagnetic interference (EMI) near open slots.
Additional information
| Weight | 0.12 kg |
|---|---|
| Country of Origin | USA |
| Dimension | 3.5 x 13 x 13.5 cm |
0.0 Average Rating Rated (0 Reviews)