Description

Configured for structural mounting and electrical backplane routing in Bently Nevada 3300 Series machinery protection platforms, the Bently Nevada 3300/05-22-00-00 (3300/05 6-Position Rack) provides direct physical/electrical execution.

Suffix Breakdown & Model Matrix

Option CodeParameter SlotTechnical Specification
22Rack Size / Mounting Option6-position standard mount rack structure
00Agency Approval OptionNo agency approvals required
00Mounting OptionStandard panel mount configuration
00Reserved OptionStandard factory setup configuration

Hardware Specifications

ParameterSpecification
Model3300/05-22-00-00
BrandBently Nevada
OriginUnited States
Weight2.72 kg (empty chassis matrix)
Dimensions319.3 mm x 265.9 mm x 424.2 mm
Operating Temp-20 deg C to +65 deg C
Backplane Slots1 x Power Supply, 1 x System Monitor, 4 x Monitor Modules
MaterialConductive anti-static injection molded framework

Rotor Dynamics and Cross-Talk Suppression

The 6-position chassis architecture forms the central electrical highway linking the power supply to individual processing cards. Consequently, the high-speed bus lines built into the printed backplane assembly route input signals directly to individual channels without internal jumper wires. To safeguard dynamic sensor processing, the backplane design maintains rigorous cross-talk suppression paths, isolating individual channel power grids from high-frequency relay activations. This trace separation ensures that adjacent cards perform independent eddy-current probe scaling calculations and gap voltage validation routines without data corruption during extreme rotor dynamics events.

Frequently Asked Questions

Q: Which positions are reserved for specific modules in the 3300/05-22-00-00 chassis?

A: Position 1 (the leftmost slot) is strictly reserved for the system power supply module. Position 2 (immediately adjacent) houses the System Monitor, while positions 3 through 6 accept any combination of standard 3300 machinery protection monitors.

Q: How does the anti-static mainframe material protect internal monitoring modules?

A: The chassis framework is manufactured from an injection-molded conductive polymer that continuously dissipates structural electrostatic discharge (ESD). Consequently, static charges route safely to the cabinet ground before reaching sensitive internal circuit cards.

Field Installation Guidelines

  • Cabinet Grounding Execution: Secure a low-impedance copper ground wire from the rear rack grounding stud to the primary instrument earth bus. As a result, this grounding action prevents ambient electromagnetic field interference from destabilizing sensor data paths.
  • Rear Module Clearance Constraints: Maintain a minimum structural clearance distance of 101.6 mm behind the rear of the chassis. Consequently, this spacing allows for proper ventilation and unobstructed insertion or removal of individual signal input/relay modules.
  • Panel Cutout Panel Fastening: Insert the chassis through the pre-drilled customer panel cutout matrix. Subsequently, tighten all four integrated panel clamp fasteners to achieve a rigid mechanical bond capable of resisting continuous industrial machine vibrations.

Additional information

Weight2.72 kg
Dimensions320 × 150 × 230 mm

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