Description

Configured for solid-state power switching and phase control in industrial drive systems, the Allen Bradley 80173-110-02-R (80173-110 Thyristor Board PCB) provides direct physical/electrical execution. It handles pulse triggering, gating signals, and high-current power distribution to maintain switching performance across control cabinets.

Hardware Specifications

ParameterSpecification
Model80173-110-02-R
BrandAllen Bradley
OriginUSA
Weight1.56 kg
Dimensions29.2 x 20.7 x 5.5 cm
Operating Temp0 to 60 deg C
Power ConsumptionStandard Backplane / Gate Drive Power
Current Rating10 A Nominal Capacity
SystemPLC / Industrial Drive System
HS Code8537101190

Deterministic Network & Backplane Integration

The Allen Bradley 80173-110-02-R thyristor printed circuit board integrates directly into specialized power control assemblies and PLC-adjacent architectures. Backplane bus communication velocity and gate-firing synchronicity ensure deterministic switching execution without phase jitter. Solid-state switching dynamics prevent localized electrical noise from coupling into high-density Ethernet/IP or ControlNet networks. Correct firmware flash compatibility across drive interface modules maintains deterministic control over SCR gate trigger pulses during continuous operation.

Frequently Asked Questions

Q: What precautions should be taken regarding gate-trigger wiring and signal isolation?

A: Pulse transformer outputs and gate control traces must remain isolated from high-voltage AC mains. Shielded twisted-pair cables should be used for external control inputs to prevent parasitic capacitance and electromagnetic interference from causing false SCR firing.

Q: Can the board be swapped while power is applied to the main bus bar?

A: No. High-voltage AC/DC power must be completely disconnected and discharged before handling or replacing the thyristor board to prevent arc flash risks and silicon degradation.

Field Installation Guidelines

  • Enclosure Clearance & Thermal Dissipation: Mount the circuit board in a vertical orientation inside an IP54 or NEMA 12 rated enclosure. Maintain a minimum of 50 mm clearance above and below the assembly to allow passive convection across heat sinks and thyristor power modules.
  • Grounding & Shielding Integrity: Ensure the printed circuit board mounting standoffs establish low-impedance ground contact with the enclosure backplate. Drain wires from shielded control cables must terminate at a dedicated protective earth (PE) bus bar.
  • Terminal Torque Specifications: Secure high-current connections and wiring harness connectors using calibrated torque screwdrivers. Over-tightening can crack PCB traces near terminal blocks, while under-tightening leads to thermal hot spots under continuous 10 A load execution.

Additional information

Weight1.56 kg
Country of Origin

USA

Dimension

29.2 x 20.7 x 5.5 cm

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